NXP Semiconductors dezvoltă tehnologii pentru semiconductori destinate aplicațiilor auto, Internetului obiectelor și industriei. Produsele sale includ microcontrolere, procesoare securizate, soluții de conectivitate wireless și tehnologii pentru calcul inteligent la marginea rețelei și autentificare securizată. Activitatea companiei sprijină sisteme conectate și integrate, axate pe siguranță, în industria auto și în piețe mai largi de hardware.
Senior Principal Semiconductor Packaging Engineer
Lead package innovation at NXP Semiconductors, developing architectures and technology roadmaps for automotive, robotics, and high-performance computing applications. Drive packaging solutions from feasibility and prototype builds through qualification and production ramp.
Descriere
- Lead technical work within NXP’s Package Innovation organization.
- Develop package solutions for new products and technologies across NXP business lines.
- Create standard and advanced packaging solutions for vehicle electrification, power management, robotics, and high-performance computing and data centers, with an emphasis on analog and power delivery.
- Set package architectures, materials, structures, and assembly processes to meet reliability, performance, manufacturability, and cost targets.
- Lead complex technical programs across internal teams, assembly sites, suppliers, OSATs, and external technology partners.
- Track trends in advanced, panel-level, and power packaging.
- Set and advance related technology roadmaps.
- Deliver packaging work for new product and technology introductions, from feasibility, design, and prototypes through characterization, qualification, risk retirement, release, and production ramp support.
- Travel internationally as needed to NXP assembly sites, OSATs, suppliers, and technology partners.
Cerințe
- Bachelor’s degree or higher in mechanical engineering, materials science, chemical engineering, electrical engineering, or a related field.
- At least 10 years of experience in semiconductor packaging development, package technology, assembly process development, package design, product or package engineering, or a related area.
- Broad working knowledge of IC package families, including QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.
- Experience leading cross-functional technical projects with engineering, co-design, manufacturing, product, quality, supplier, and management contributors.
- Clear communication of technical tradeoffs, risks, recommendations, and project status to technical and management audiences.
- Fluent written and spoken English.
- Preferred: deep expertise in one or more advanced packaging areas, such as fan-out or panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die or passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high-power packaging.
Beneficii
- Equal opportunity and affirmative action employment policy.
- Reasonable accommodations for otherwise qualified individuals with disabilities.
- International travel opportunities to NXP assembly sites, OSATs, suppliers, and technology partners.