Cadence Design Systems
Cadence Design Systems
Cadence Design Systems dezvoltă software de calcul, hardware și proprietate intelectuală pentru proiectarea electronică și a sistemelor. Cu peste 30 de ani de experiență în software și un accent pe proiectarea inteligentă a sistemelor, compania ajută organizațiile de top să transforme conceptele de design în produse electronice avansate. Tehnologiile sale sprijină activități din domenii precum calculul la scară hiper-mare, comunicațiile 5G, industria auto, dispozitivele mobile, industria aerospațială, bunurile de consum, sectorul industrial și sănătatea.

Chip Lead, Physical Design Director

Lead Cadence’s physical design and design-for-test efforts for advanced SoC projects, guiding RTL-to-GDS delivery for data center, automotive, and AI customers. Own PPA, timing, power, and schedule closure across complex semiconductor engagements.

Descriere

  • Lead Physical Design and Design for Test teams on complex customer SoC projects from RTL or netlist through GDS.
  • Partner directly with customers throughout each engagement, from kickoff through final GDS delivery.
  • Make technical decisions, resolve design trade-offs, and develop solutions that meet customer PPA and schedule targets.
  • Advise customers on suitable foundry processes, technology nodes, libraries, and memory compilers.
  • Define sign-off criteria that balance product features and implementation cost.
  • Work with internal Cadence teams on technical presentations and the advancement of internal AI initiatives.
  • Coordinate with customer or internal RTL and synthesis teams to meet key metrics before the physical design phase gate.
  • Collaborate with Cadence tools R&D to improve implementation tools and methodologies.
  • Capture and share best practices and lessons learned to increase efficiency, project success, and AI adoption.

Cerințe

  • At least 15 years of industry experience in physical design.
  • Bachelor’s degree in computer science, computer engineering, electrical engineering, or a related discipline.
  • Strong understanding of digital design and semiconductor fundamentals, plus static timing analysis and timing constraints.
  • Hands-on experience with IC digital implementation flows and backend EDA tools, including place and route, clock tree synthesis, IR drop analysis, backend timing, and power closure.
  • Proven ability to complete design closure for top-level chip projects.
  • Expertise in PPA optimization and balancing performance, power, and area against demanding design targets.
  • Experience working with advanced process nodes at 7nm or below.
  • Proficiency with scripting languages such as Tcl, Perl, or Python.
  • Strong customer-facing communication and problem-solving abilities.
  • Commitment to continuous learning and broadening technical expertise.
  • Experience building effective technical partnerships with RTL, DFT, CAD, and library teams.
  • Preferred: Master’s degree in computer science, computer engineering, electrical engineering, or a related discipline.
  • Preferred: Experience with front-end EDA and IC digital implementation flows, including synthesis, DFT, and logical equivalence checking.
  • Preferred: Experience with Cadence tools such as Genus, Innovus, Conformal, Tempus, Modus, or comparable tools including ICC, ICC2, DC, or PrimeTime.
  • Preferred: Experience with advanced process nodes at 5nm or below.
  • Preferred: Expertise in domains such as CPUs, GPUs, AI engines, networks on chip, or high-speed interfaces.
  • Preferred: Experience with 3D IC design.

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