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NVIDIA
NVIDIA
Sponsor pentru viza H1BAsistență medicalăIndustria prelucrătoareInteligență artificială
NVIDIA dezvoltă tehnologii de calcul accelerat și inteligență artificială utilizate în domenii precum jocurile video, centrele de date, cloud computing, asistența medicală, producția, industria auto și robotica. Activitatea companiei acoperă unități de procesare grafică, platforme de inteligență artificială, simulare și soluții dedicate anumitor industrii, inclusiv NVIDIA Omniverse pentru fluxuri de lucru colaborative 3D, NVIDIA DRIVE pentru dezvoltarea vehiculelor autonome și NVIDIA Clara pentru aplicații medicale. Compania reunește echipe tehnice numeroase care lucrează la infrastructura și software-ul ce susțin calculul avansat, simularea și analiza bazată pe inteligență artificială.
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NVIDIA Package Layout Engineer, Hardware

Design high-speed ASIC substrates for NVIDIA GPUs and SoCs using Cadence tools. Develop package layouts, pinouts, routing, and power distribution for advanced semiconductor products.

USStatele Unite ale AmericiiAZArizonaCACaliforniaNVNevadaOROregonWAWashington
108.000 $ – 184.000 $ / an
HibridNormă întreagăJuniorNivel mediuLimbă Obligatorie: englezăInginer hardware

Descriere

  • Partner with the Technical Package Lead and design teams to develop detailed IC substrate layouts for NVIDIA products.
  • Coordinate schedules with design teams and address cost, manufacturing, and electrical design issues.
  • Work with the Layout team to implement high-speed, high-density ASIC packages.
  • Create substrate breakout patterns for ASIC packages.
  • Optimize package pin assignments using system-level trade-offs.
  • Use Cadence APD or SiP tools for package routing, placement, stack-up, reference planes, and power distribution.
  • Recommend layout trade-offs to the Technical Package Lead.
  • Assess package size, cost, and system performance through design feasibility studies.
  • Create symbols and CAD library databases with Cadence APD tools.
  • Develop methods to improve layout productivity.

Cerințe

  • Bachelor’s degree in Electrical Engineering or equivalent experience.
  • At least two years of PCB layout experience with graphics cards, motherboards, line cards, or related technology.
  • HDI design experience is a plus.
  • Substrate layout experience with wire bond and flip chip packages is preferred.
  • Strong experience with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager.
  • Solid understanding of high-speed signal integrity practices.
  • Virtuoso and Calibre experience is a plus.
  • Experience using Valor is helpful.

Beneficii

  • Equity compensation.
  • Employee benefits.

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