NVIDIA
NVIDIA
NVIDIA ойындарда, деректер орталықтарында, бұлтты есептеулерде, денсаулық сақтауда, өндірісте, автомобиль өнеркәсібінде және робот техникасында қолданылатын жеделдетілген есептеу мен жасанды интеллект технологияларын әзірлейді. Компанияның жұмысы графикалық процессорларды, жасанды интеллект платформаларын, модельдеуді және салаларға арналған шешімдерді қамтиды. Олардың қатарында бірлескен 3D жұмыс процестеріне арналған NVIDIA Omniverse, автономды көліктерді әзірлеуге арналған NVIDIA DRIVE және денсаулық сақтау саласындағы қолданбаларға арналған NVIDIA Clara бар. Компания озық есептеулерді, модельдеуді және жасанды интеллект негізіндегі талдауды қолдайтын инфрақұрылым мен бағдарламалық жасақтамада жұмыс істейтін ірі техникалық командаларды біріктіреді.

NVIDIA Package Layout Engineer, Hardware

Design high-speed ASIC substrates for NVIDIA GPUs and SoCs using Cadence tools. Develop package layouts, pinouts, routing, and power distribution for advanced semiconductor products.

Сипаттама

  • Partner with the Technical Package Lead and design teams to develop detailed IC substrate layouts for NVIDIA products.
  • Coordinate schedules with design teams and address cost, manufacturing, and electrical design issues.
  • Work with the Layout team to implement high-speed, high-density ASIC packages.
  • Create substrate breakout patterns for ASIC packages.
  • Optimize package pin assignments using system-level trade-offs.
  • Use Cadence APD or SiP tools for package routing, placement, stack-up, reference planes, and power distribution.
  • Recommend layout trade-offs to the Technical Package Lead.
  • Assess package size, cost, and system performance through design feasibility studies.
  • Create symbols and CAD library databases with Cadence APD tools.
  • Develop methods to improve layout productivity.

Талаптар

  • Bachelor’s degree in Electrical Engineering or equivalent experience.
  • At least two years of PCB layout experience with graphics cards, motherboards, line cards, or related technology.
  • HDI design experience is a plus.
  • Substrate layout experience with wire bond and flip chip packages is preferred.
  • Strong experience with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager.
  • Solid understanding of high-speed signal integrity practices.
  • Virtuoso and Calibre experience is a plus.
  • Experience using Valor is helpful.

Артықшылықтар

  • Equity compensation.
  • Employee benefits.

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