NVIDIA
NVIDIA
NVIDIA o‘yinlar, ma’lumotlar markazlari, bulutli hisoblash, sog‘liqni saqlash, ishlab chiqarish, avtomobilsozlik va robototexnika sohalarida qo‘llaniladigan tezlashtirilgan hisoblash hamda sun’iy intellekt texnologiyalarini ishlab chiqadi. Kompaniyaning faoliyati grafik protsessorlar, sun’iy intellekt platformalari, simulyatsiya va muayyan sohalarga mo‘ljallangan yechimlarni qamrab oladi. Bular qatoriga hamkorlikdagi 3D ish jarayonlari uchun NVIDIA Omniverse, avtonom transport vositalarini ishlab chiqish uchun NVIDIA DRIVE va sog‘liqni saqlash ilovalari uchun NVIDIA Clara kiradi. Kompaniya ilg‘or hisoblash, simulyatsiya va sun’iy intellekt asosidagi tahlilni qo‘llab-quvvatlaydigan infratuzilma hamda dasturiy ta’minot ustida ishlaydigan yirik texnik jamoalarni birlashtiradi.

NVIDIA Package Layout Engineer, Hardware

Design high-speed ASIC substrates for NVIDIA GPUs and SoCs using Cadence tools. Develop package layouts, pinouts, routing, and power distribution for advanced semiconductor products.

Tavsif

  • Partner with the Technical Package Lead and design teams to develop detailed IC substrate layouts for NVIDIA products.
  • Coordinate schedules with design teams and address cost, manufacturing, and electrical design issues.
  • Work with the Layout team to implement high-speed, high-density ASIC packages.
  • Create substrate breakout patterns for ASIC packages.
  • Optimize package pin assignments using system-level trade-offs.
  • Use Cadence APD or SiP tools for package routing, placement, stack-up, reference planes, and power distribution.
  • Recommend layout trade-offs to the Technical Package Lead.
  • Assess package size, cost, and system performance through design feasibility studies.
  • Create symbols and CAD library databases with Cadence APD tools.
  • Develop methods to improve layout productivity.

Talablar

  • Bachelor’s degree in Electrical Engineering or equivalent experience.
  • At least two years of PCB layout experience with graphics cards, motherboards, line cards, or related technology.
  • HDI design experience is a plus.
  • Substrate layout experience with wire bond and flip chip packages is preferred.
  • Strong experience with Cadence APD or SiP and/or PCB layout tools, including Constraint Manager.
  • Solid understanding of high-speed signal integrity practices.
  • Virtuoso and Calibre experience is a plus.
  • Experience using Valor is helpful.

Imtiyozlar

  • Equity compensation.
  • Employee benefits.

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