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Intel Corporation
Intel Corporation
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Intel Corporation develops and manufactures computing technologies used across personal computers, data centers, cloud infrastructure, edge systems, networking, and 5G environments. Its portfolio includes Intel Core, Xeon, and Atom processors, along with discrete graphics, AI accelerators, silicon photonics, embedded solutions, and networking and storage technologies. The company also supports developers through software tools and technical resources, with a focus on performance, security, and advancing AI-enabled computing.
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Staff EMIB-T Substrate Yield Engineer | Intel | Phoenix Hybrid

Lead EMIB-T substrate yield engineering at Intel, reducing defects and closing supplier issues. Contribute to advanced packaging development and manufacturing readiness.

USUnited StatesAZArizonaNMNew MexicoOROregon
$180,770 – $255,200 / year
HybridFull-timeLeadEnglish RequiredEngineer

Description

  • Manage daily yield performance and issue resolution across assigned supplier lines, modules, products, or process areas
  • Lead investigations from containment and hypothesis formation through experimentation, failure analysis, corrective action, and sustained improvement
  • Apply statistical and spatial analysis to detect patterns across lines, tools, materials, panel locations, geometries, products, and time periods
  • Define supplier actions, accountable owners, completion criteria, control limits, and verification plans
  • Contribute to DFM/DFY, qualification, ramp readiness, change control, and dashboard or automated analytics deployments
  • Document reusable lessons and clearly communicate facts, hypotheses, decisions, and remaining risks
  • Improve supplier yield, reduce defects, close technical issues, and advance process-control maturity for next-generation EMIB-T substrates
  • Support technology development and manufacturing readiness across Intel Foundry Services and Intel Product Groups

Requirements

  • Bachelor’s degree plus 8+ years of experience in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical field; or a master’s degree plus 6+ years; or a PhD plus 4+ years
  • At least 5 years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related discipline
  • Practical experience in substrate, advanced packaging, or semiconductor yield engineering
  • Background in statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and high-volume manufacturing execution
  • Experience building or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification
  • Ability to collaborate across multiple organizations and influence stakeholders
  • Availability for an expatriate assignment in Japan
  • This role is not eligible for Intel immigration sponsorship
  • Preferred: Direct experience working with substrate suppliers and external manufacturing partners
  • Preferred: Demonstrated experience leading technical programs
  • Preferred: Experience with semi-additive processing, build-up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration
  • Preferred: Experience supporting technology development, qualification, and manufacturing ramp for advanced semiconductor technologies
  • Preferred: Experience with automated data pipelines, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification

Benefits

  • Competitive compensation
  • Stock bonus opportunities
  • Health coverage
  • Retirement benefits
  • Vacation benefits
  • Hybrid work arrangement that divides time between on-site and off-site work

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