Intel Corporation
Intel Corporation
Intel Corporation व्यक्तिगत कंप्यूटरों, डेटा केंद्रों, क्लाउड अवसंरचना, एज सिस्टम, नेटवर्किंग और 5G वातावरणों में उपयोग की जाने वाली कंप्यूटिंग प्रौद्योगिकियों का विकास और निर्माण करती है। इसके उत्पाद पोर्टफोलियो में Intel Core, Xeon और Atom प्रोसेसर के साथ-साथ अलग ग्राफिक्स, AI एक्सेलेरेटर, सिलिकॉन फोटोनिक्स, एम्बेडेड समाधान तथा नेटवर्किंग और स्टोरेज प्रौद्योगिकियाँ शामिल हैं। कंपनी प्रदर्शन और सुरक्षा पर ध्यान केंद्रित करते हुए सॉफ्टवेयर टूल और तकनीकी संसाधनों के माध्यम से डेवलपर्स का भी सहयोग करती है तथा AI-सक्षम कंप्यूटिंग को आगे बढ़ाने में योगदान देती है।

Staff EMIB-T Substrate Yield Engineer | Intel | Phoenix Hybrid

Lead EMIB-T substrate yield engineering at Intel, reducing defects and closing supplier issues. Contribute to advanced packaging development and manufacturing readiness.

विवरण

  • Manage daily yield performance and issue resolution across assigned supplier lines, modules, products, or process areas
  • Lead investigations from containment and hypothesis formation through experimentation, failure analysis, corrective action, and sustained improvement
  • Apply statistical and spatial analysis to detect patterns across lines, tools, materials, panel locations, geometries, products, and time periods
  • Define supplier actions, accountable owners, completion criteria, control limits, and verification plans
  • Contribute to DFM/DFY, qualification, ramp readiness, change control, and dashboard or automated analytics deployments
  • Document reusable lessons and clearly communicate facts, hypotheses, decisions, and remaining risks
  • Improve supplier yield, reduce defects, close technical issues, and advance process-control maturity for next-generation EMIB-T substrates
  • Support technology development and manufacturing readiness across Intel Foundry Services and Intel Product Groups

आवश्यकताएँ

  • Bachelor’s degree plus 8+ years of experience in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical field; or a master’s degree plus 6+ years; or a PhD plus 4+ years
  • At least 5 years of experience in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related discipline
  • Practical experience in substrate, advanced packaging, or semiconductor yield engineering
  • Background in statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and high-volume manufacturing execution
  • Experience building or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification
  • Ability to collaborate across multiple organizations and influence stakeholders
  • Availability for an expatriate assignment in Japan
  • This role is not eligible for Intel immigration sponsorship
  • Preferred: Direct experience working with substrate suppliers and external manufacturing partners
  • Preferred: Demonstrated experience leading technical programs
  • Preferred: Experience with semi-additive processing, build-up films, microvias, copper plating, lithography, lamination, embedded silicon, TSV, 2.5D/3D packaging, or heterogeneous integration
  • Preferred: Experience supporting technology development, qualification, and manufacturing ramp for advanced semiconductor technologies
  • Preferred: Experience with automated data pipelines, dashboards, image analytics, computer vision, AI/ML defect detection, or automated defect classification

लाभ

  • Competitive compensation
  • Stock bonus opportunities
  • Health coverage
  • Retirement benefits
  • Vacation benefits
  • Hybrid work arrangement that divides time between on-site and off-site work

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