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Oxford Quantum Circuits (OQC) develops enterprise-focused quantum computing technology for organizations exploring practical applications of quantum systems. Founded in 2017, the company combines expertise in quantum computing, artificial intelligence, and enterprise technology to deliver solutions intended to be accessible, secure, and reliable. Its work centers on helping businesses build quantum capabilities and investigate complex problems that may benefit from quantum computing.
Senior Hardware Engineer, QPU Packaging – OQC (Hybrid, UK)
Senior Hardware Engineer responsible for improving millikelvin thermal performance in QPU packaging at Oxford Quantum Circuits. The role develops scalable packaging technologies for the Titan and Athena quantum systems.
Description
- Lead cryogenic thermal simulations for OQC’s QPU packaging and connect system thermal budgets with quantum hardware needs.
- Build and validate thermal models at millikelvin temperatures.
- Assess material behaviour, thermal contraction, heat transfer and interface performance to improve package capability.
- Convert simulation results and engineering findings into design rules, specifications, material limits, dimensions and tolerances.
- Coordinate mechanical, electrical and thermal interfaces, including DC/RF requirements and integration with the wider cryogenic system.
- Work with Quantum Test Engineers to interpret measurements and apply observed performance to package optimisation.
- Create technologies, methods and processes that support scaling QPU hardware for future quantum computers.
- Support current QPU packages and upcoming architectures, including the Titan and Athena programmes.
- Collaborate with mechanical design, materials science, nanofabrication, cryogenics and quantum test specialists.
Requirements
- Substantial experience with thermal simulation in Ansys Mechanical or an equivalent package, preferably in cryogenic or low-temperature settings.
- A track record of developing complex, high-quality hardware in demanding engineering or research and development environments.
- Strong knowledge of thermal and mechanical behaviour, including material properties and interfaces that affect hardware performance.
- Experience converting simulation and experimental results into engineering decisions, requirements and technical documentation.
- Ability to collaborate across disciplines and explain complex technical findings clearly to engineers with different specialisms.
- A bachelor’s or master’s degree in engineering or a related technical field, or equivalent industry experience.
- Confidence taking ownership of open-ended technical problems and progressing them from investigation to implementation.
- A PhD or research background in a relevant engineering, physics or instrumentation field is desirable but not required.
Benefits
- Join a specialist team working at the forefront of advanced computing.
- Work in an environment that encourages ambitious innovation.
- Use distinctive laboratory infrastructure.
- Contribute to work extending the capabilities of computation.
- Access company benefits and a positive workplace culture, with details available on the OQC careers page.
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