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Emerson is a global technology, software, and engineering company with expertise in automation and advanced industrial solutions. Its work spans manufacturing, consulting, and food and beverage, supporting organizations that aim to operate more safely, efficiently, intelligently, and sustainably. Emerson also emphasizes environmental, social, and governance priorities, alongside diversity, equity, inclusion, community engagement, and STEM initiatives. For professionals exploring opportunities in industrial technology and engineering, the company brings together a broad international workforce focused on solving complex operational challenges.
Principal PCB Design Engineer
Lead complex RF and microwave PCB layout projects at Emerson, mentoring designers and partnering with engineering teams. The role combines advanced board design with cross-functional collaboration.
Description
- Lead complex RF and microwave PCB design and advanced layout projects from design through delivery.
- Partner with principal and chief engineers across hardware disciplines.
- Apply specialized expertise to strengthen project outcomes.
- Independently deliver complex RF, microwave, and other PCB layouts using product team inputs and guidance.
- Guide junior engineers through the PCB design process.
- Assess and learn emerging PCB design tools and technologies independently.
- Attend occasional evening meetings for training, mentoring, collaboration, and design reviews.
- Work with global engineering and cross-functional product teams to deliver high-quality hardware solutions.
Requirements
- Bring at least 15 years of hands-on PCB layout experience.
- Have specialized RF and microwave PCB design experience, including grounding, shielding, and transmission lines.
- Be familiar with layout practices for high-speed, high-density digital circuits and high-power, high-current analog circuits.
- Communicate effectively and work collaboratively.
- Be authorized to work in the United States without sponsorship now or in the future.
- Temporary visa holders—including E, F-1 (including OPT or CPT), H-1, H-2, L-1, B, J, and TN—or anyone needing current or future sponsorship are ineligible for hire.
- A bachelor's degree in a STEM field is preferred.
- Experience with the Siemens Xpedition toolset is preferred.
- Wire bond design experience, such as with Siemens Xpedition Advanced Packaging tools, is preferred.
- Experience with RF and microwave simulation tools such as AWR or CST is preferred.
- Experience with signal or power integrity tools such as HyperLynx or HyperLynx DRC is preferred.
- Hands-on layout experience with high-speed, high-density digital circuits and/or high-power, high-current analog circuits is preferred.
- Experience with PCB platforms other than Xpedition is preferred.
Benefits
- Market-leading 401(k) and profit-sharing plan.
- Multiple medical insurance plans.
- Dental and vision coverage.
- Family formation benefits.
- Paid maternity and paternity leave.
- Employee Assistance Program.
- Tuition reimbursement.
- Employee resource groups.
- Recognition programs.
- Flexible time-off options, including vacation, holidays, and sick leave.
- In-person and virtual training.
- Mentoring and coaching.
- Project management training.
- On-the-job training.
- Flexible benefits for physical, mental, financial, and social needs.
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