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Emerson
Emerson
Sponsor pentru viza H1BAlimente și băuturiConsultanțăIndustria prelucrătoare
Emerson este o companie globală de tehnologie, software și inginerie, cu expertiză în automatizare și soluții industriale avansate. Activitatea sa acoperă producția, consultanța și industria alimentară și a băuturilor, sprijinind organizații care urmăresc să opereze mai sigur, mai eficient, mai inteligent și mai sustenabil. Emerson pune, de asemenea, accent pe prioritățile de mediu, sociale și de guvernanță, precum și pe diversitate, echitate, incluziune, implicare comunitară și inițiative STEM. Pentru profesioniștii care explorează oportunități în tehnologia industrială și inginerie, compania reunește o forță de muncă internațională extinsă, concentrată pe soluționarea provocărilor operaționale complexe.
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Principal PCB Design Engineer

Lead complex RF and microwave PCB layout projects at Emerson, mentoring designers and partnering with engineering teams. The role combines advanced board design with cross-functional collaboration.

USStatele Unite ale AmericiiTXTexasHibridNormă întreagăLiderLimbă Obligatorie: englezăInginer hardware

Descriere

  • Lead complex RF and microwave PCB design and advanced layout projects from design through delivery.
  • Partner with principal and chief engineers across hardware disciplines.
  • Apply specialized expertise to strengthen project outcomes.
  • Independently deliver complex RF, microwave, and other PCB layouts using product team inputs and guidance.
  • Guide junior engineers through the PCB design process.
  • Assess and learn emerging PCB design tools and technologies independently.
  • Attend occasional evening meetings for training, mentoring, collaboration, and design reviews.
  • Work with global engineering and cross-functional product teams to deliver high-quality hardware solutions.

Cerințe

  • Bring at least 15 years of hands-on PCB layout experience.
  • Have specialized RF and microwave PCB design experience, including grounding, shielding, and transmission lines.
  • Be familiar with layout practices for high-speed, high-density digital circuits and high-power, high-current analog circuits.
  • Communicate effectively and work collaboratively.
  • Be authorized to work in the United States without sponsorship now or in the future.
  • Temporary visa holders—including E, F-1 (including OPT or CPT), H-1, H-2, L-1, B, J, and TN—or anyone needing current or future sponsorship are ineligible for hire.
  • A bachelor's degree in a STEM field is preferred.
  • Experience with the Siemens Xpedition toolset is preferred.
  • Wire bond design experience, such as with Siemens Xpedition Advanced Packaging tools, is preferred.
  • Experience with RF and microwave simulation tools such as AWR or CST is preferred.
  • Experience with signal or power integrity tools such as HyperLynx or HyperLynx DRC is preferred.
  • Hands-on layout experience with high-speed, high-density digital circuits and/or high-power, high-current analog circuits is preferred.
  • Experience with PCB platforms other than Xpedition is preferred.

Beneficii

  • Market-leading 401(k) and profit-sharing plan.
  • Multiple medical insurance plans.
  • Dental and vision coverage.
  • Family formation benefits.
  • Paid maternity and paternity leave.
  • Employee Assistance Program.
  • Tuition reimbursement.
  • Employee resource groups.
  • Recognition programs.
  • Flexible time-off options, including vacation, holidays, and sick leave.
  • In-person and virtual training.
  • Mentoring and coaching.
  • Project management training.
  • On-the-job training.
  • Flexible benefits for physical, mental, financial, and social needs.

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