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Emerson
Emerson
H1B vīzas sponsorsKonsultācijasPārtika un dzērieniRažošana
Emerson ir globāls tehnoloģiju, programmatūras un inženierijas uzņēmums, kas specializējas automatizācijā un progresīvos rūpniecības risinājumos. Tā darbība aptver ražošanu, konsultācijas, kā arī pārtikas un dzērienu nozari, atbalstot organizācijas, kuru mērķis ir strādāt drošāk, efektīvāk, viedāk un ilgtspējīgāk. Emerson pievēršas arī vides, sociālās atbildības un pārvaldības prioritātēm, kā arī daudzveidībai, vienlīdzībai, iekļaušanai, iesaistei kopienā un STEM iniciatīvām. Profesionāļiem, kuri meklē iespējas rūpniecības tehnoloģiju un inženierijas jomā, uzņēmums piedāvā plašu starptautisku darba vidi, kas koncentrējas uz sarežģītu darbības izaicinājumu risināšanu.
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Vakances uzņēmumā

Principal PCB Design Engineer

Lead complex RF and microwave PCB layout projects at Emerson, mentoring designers and partnering with engineering teams. The role combines advanced board design with cross-functional collaboration.

USAmerikas Savienotās ValstisTXTeksasaHibrīdiPilna slodzeVadošais speciālistsNepieciešamā Valoda: angļuAparatūras inženieris

Apraksts

  • Lead complex RF and microwave PCB design and advanced layout projects from design through delivery.
  • Partner with principal and chief engineers across hardware disciplines.
  • Apply specialized expertise to strengthen project outcomes.
  • Independently deliver complex RF, microwave, and other PCB layouts using product team inputs and guidance.
  • Guide junior engineers through the PCB design process.
  • Assess and learn emerging PCB design tools and technologies independently.
  • Attend occasional evening meetings for training, mentoring, collaboration, and design reviews.
  • Work with global engineering and cross-functional product teams to deliver high-quality hardware solutions.

Prasības

  • Bring at least 15 years of hands-on PCB layout experience.
  • Have specialized RF and microwave PCB design experience, including grounding, shielding, and transmission lines.
  • Be familiar with layout practices for high-speed, high-density digital circuits and high-power, high-current analog circuits.
  • Communicate effectively and work collaboratively.
  • Be authorized to work in the United States without sponsorship now or in the future.
  • Temporary visa holders—including E, F-1 (including OPT or CPT), H-1, H-2, L-1, B, J, and TN—or anyone needing current or future sponsorship are ineligible for hire.
  • A bachelor's degree in a STEM field is preferred.
  • Experience with the Siemens Xpedition toolset is preferred.
  • Wire bond design experience, such as with Siemens Xpedition Advanced Packaging tools, is preferred.
  • Experience with RF and microwave simulation tools such as AWR or CST is preferred.
  • Experience with signal or power integrity tools such as HyperLynx or HyperLynx DRC is preferred.
  • Hands-on layout experience with high-speed, high-density digital circuits and/or high-power, high-current analog circuits is preferred.
  • Experience with PCB platforms other than Xpedition is preferred.

Priekšrocības

  • Market-leading 401(k) and profit-sharing plan.
  • Multiple medical insurance plans.
  • Dental and vision coverage.
  • Family formation benefits.
  • Paid maternity and paternity leave.
  • Employee Assistance Program.
  • Tuition reimbursement.
  • Employee resource groups.
  • Recognition programs.
  • Flexible time-off options, including vacation, holidays, and sick leave.
  • In-person and virtual training.
  • Mentoring and coaching.
  • Project management training.
  • On-the-job training.
  • Flexible benefits for physical, mental, financial, and social needs.

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