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NXP Semiconductors
NXP Semiconductors
HardwareIndustria autoIndustria prelucrătoare
NXP Semiconductors dezvoltă tehnologii pentru semiconductori destinate aplicațiilor auto, Internetului obiectelor și industriei. Produsele sale includ microcontrolere, procesoare securizate, soluții de conectivitate wireless și tehnologii pentru calcul inteligent la marginea rețelei și autentificare securizată. Activitatea companiei sprijină sisteme conectate și integrate, axate pe siguranță, în industria auto și în piețe mai largi de hardware.
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Locurile de muncă ale companiei

Package Design Electrical Engineer – Austin Onsite

Designs semiconductor packages by developing electromagnetic models, optimizing electrical layouts, and supporting system-level integration. The role focuses on package performance, manufacturability, cost, and collaboration with SoC and PCB teams.

USStatele Unite ale AmericiiAZArizonaTXTexasLa sediuNormă întreagăNivel mediuSeniorLimbă Obligatorie: englezăInginer electrician

Descriere

  • Develop optimized package design solutions for new product and new technology introductions
  • Define package architectures that satisfy electrical performance, manufacturability, and cost requirements
  • Use electromagnetic modeling tools to verify package performance and document modeling results
  • Collaborate with SoC and PCB teams to improve package solution performance
  • Create electrical design rules for the Package Design Layout team and optimize package layouts using modeling data to improve I/O interface and power performance
  • Provide package electrical data and models to business-line teams for system-level simulation

Cerințe

  • MSEE or higher, with experience in microelectronics packaging design and electromagnetic modeling or a related field
  • Educational background in electromagnetic engineering
  • Strong proficiency with electromagnetic modeling and simulation tools such as HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, or Cadence signal and power integrity tools is strongly preferred
  • Experience with RF design, multi-gigahertz wired and wireless modeling, and antenna modeling is preferred
  • Understanding of electrical design for semiconductor I/O interfaces such as LVDS, DDR, and SerDes
  • PCB design experience or experience working with PCB designers is preferred
  • Knowledge of die-level back-end-of-line design is a plus
  • Collaborative team approach, positive attitude, proactive self-direction, and an innovative mindset
  • Excellent written, verbal, and presentation skills
  • Ability to work effectively in a fast-paced environment, adapt to change, and collaborate with engineering and management teams globally and locally

Beneficii

  • NXP Semiconductors is an Equal Opportunity/Affirmative Action Employer
  • Reasonable accommodations are available for otherwise qualified individuals with disabilities

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