NVIDIA
NVIDIA
NVIDIA izstrādā paātrinātās skaitļošanas un mākslīgā intelekta tehnoloģijas, ko izmanto spēļu, datu centru, mākoņdatošanas, veselības aprūpes, ražošanas, autobūves un robotikas jomās. Uzņēmuma darbība aptver grafikas procesorus, mākslīgā intelekta platformas, simulāciju un nozarei paredzētus risinājumus, tostarp NVIDIA Omniverse sadarbības 3D darbplūsmām, NVIDIA DRIVE autonomo transportlīdzekļu izstrādei un NVIDIA Clara veselības aprūpes lietojumprogrammām. Uzņēmums apvieno lielas tehniskās komandas, kas strādā pie infrastruktūras un programmatūras, kura nodrošina progresīvu skaitļošanu, simulāciju un mākslīgā intelekta vadītu analītiku.

PCB Design Engineer, New College Graduate

Design and develop manufacturable PCBs for NVIDIA AI, GPU, networking, and accelerated computing systems. Partner with multidisciplinary engineering teams to bring next-generation hardware from architecture to production.

Apraksts

  • Design PCB foundations for NVIDIA AI, GPU, networking, and accelerated computing platforms
  • Turn system architectures into manufacturable hardware through PCB and interconnect design
  • Balance electrical performance, power delivery, thermal demands, mechanical limits, and product cost
  • Contribute to designs featuring processors with thousands of pins, high-bandwidth memory, communication channels operating at hundreds of gigabits per second, and multi-kilowatt power systems
  • Work with teams spanning silicon, system architecture, packaging, signal integrity, power integrity, thermal engineering, and manufacturing
  • Evaluate and implement emerging hardware technologies for AI and data center products
  • Develop physical design solutions that raise system performance, speed product development, and support manufacturing at global scale

Prasības

  • Working toward or recently earned a degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related discipline
  • Solid grounding in circuit theory, electronic systems, and hardware design principles
  • Understanding of power delivery, voltage regulation, and DC-DC converter basics
  • Knowledge of signal integrity, power integrity, and high-speed digital design
  • Strong analytical and problem-solving abilities
  • Clear communicator who works effectively with colleagues across disciplines
  • PCB, hardware, or system design experience gained through coursework, internships, research, or personal projects
  • Familiarity with PCB design software such as Cadence Allegro or comparable ECAD tools
  • Experience using SI/PI simulation or analysis tools such as Sigrity, ADS, HFSS, or equivalents
  • Knowledge of PCB production, advanced packaging, or Design-for-X (DFX) methods
  • Enthusiasm for technology, ongoing learning, and tackling difficult engineering challenges
  • Curiosity, technical leadership, and interest in building next-generation AI and accelerated computing systems

Priekšrocības

  • Mentorship and training
  • Practical, hands-on experience
  • The chance to work with leading engineers in silicon, system architecture, packaging, signal integrity, power integrity, thermal engineering, and manufacturing