„Intel Corporation“ kuria ir gamina kompiuterines technologijas, naudojamas asmeniniuose kompiuteriuose, duomenų centruose, debesų infrastruktūroje, periferinėse sistemose, tinkluose ir 5G aplinkose. Įmonės produktų portfelį sudaro „Intel Core“, „Xeon“ ir „Atom“ procesoriai, taip pat atskiros grafikos plokštės, dirbtinio intelekto spartintuvai, silicio fotonikos sprendimai, įterptiniai sprendimai bei tinklo ir duomenų saugyklų technologijos. Įmonė taip pat padeda kūrėjams teikdama programinės įrangos įrankius ir techninius išteklius, daugiausia dėmesio skirdama našumui, saugumui ir dirbtiniu intelektu grindžiamo skaičiavimo pažangai.
Senior NPI Engineer, Semiconductor Manufacturing — Intel, Penang
Lead semiconductor technology transfers, factory qualification, and product launches at Intel. Coordinate sample builds, manage launch risks, and prepare products for high-volume manufacturing.
Aprašymas
- Lead NPI launches from initial planning and technology transfer through program execution and high-volume manufacturing.
- Coordinate product development, factory qualification, manufacturing operations, and customer commitments as the primary point of contact.
- Set key milestones and deliverables for technology transfers and factory start-ups.
- Coordinate system, process, and material readiness, including factory qualification and certification.
- Manage technical programs and projects, lead teams, track schedules, and mitigate risks.
- Plan and execute sample builds, ensuring deliverables are completed for division customers.
- Coordinate new product and package start-ups with local teams, Technology Development, divisions, and Virtual Factory partners.
- Monitor success indicators for equipment capability, line yield, and process repeatability, and guide transfer certification into sustained high-volume manufacturing.
- Review post-ramp performance to identify factory-wide improvements and speed up NPI deployment at the site.
Reikalavimai
- Bachelor's degree in science or a related engineering field, such as electrical, electronic, electro-mechanical, chemical, or manufacturing engineering.
- Data-driven approach to work.
- Knowledge of structured problem-solving methods.
- Proficiency in data mining and visualization.
- At least eight years of direct experience in NPI, advanced packaging, semiconductor assembly and test, or high-tech electronics manufacturing.
- Familiarity with Assembly Test Manufacturing (ATM) configurations and end-to-end manufacturing flows is required.
- Hands-on ATM operations experience, including factory start-up, technology transfer, qualification, ramp, and high-volume manufacturing.
- Module integration experience is an advantage.
- Strong communication, leadership, and stakeholder management skills.
- Ability to align business units, including FBG, Planning, TD, and Assembly Test Manufacturing.