Phononic Inc
Phononic Inc
Phononic Inc dezvoltă tehnologie de răcire termoelectrică în stare solidă pentru centre de date, infrastructuri de inteligență artificială, componente optice de rețea, GPU-uri și memorie cu lățime de bandă mare, precum și pentru aplicații comerciale de răcire. Dispozitivele compacte, fără agent frigorific, și kiturile de sistem combină hardware termoelectric cu comenzi Thermal Fabric definite prin software, adaptând răcirea la schimbările sarcinilor de lucru. Produsele și proiectele de referință ale companiei urmăresc reducerea consumului de energie și limitarea reducerii performanței hardware în implementări pentru mediul enterprise și cel industrial.

Senior Manufacturing Engineer, On-Site in Thailand

Serve as Phononic’s technical lead at a contract manufacturing facility in Thailand. Improve assembly processes, equipment throughput, yield, quality, and production efficiency.

Descriere

  • Share Phononic headquarters’ manufacturing procedures and best practices.
  • Train contract manufacturing operators, technicians, engineers, and planners in Phononic processes.
  • Develop, improve, and implement FMEAs, OCAPs, and work instructions with engineering, production, and quality teams in North Carolina.
  • Monitor in-line process yields and carry out escalation plans as needed.
  • Report failure modes to the global operations team and work with them on root cause analysis.
  • Verify new product setups and provide qualification support with the Contract Manufacturing NPI engineering team.
  • Configure manufacturing equipment to meet factory planning goals.
  • Serve as the on-site expert on Phononic assembly processes and equipment, improving throughput and yield.
  • Join daily manufacturing reviews with the US team.
  • Work with the on-site automation engineer to introduce next-generation manufacturing technologies on Phononic equipment.
  • Lead projects to reduce costs and improve process efficiency.

Cerințe

  • Bachelor’s degree in engineering, science, or a related field, or equivalent.
  • At least 5 years of engineering experience in high-precision electronic device or semiconductor manufacturing.
  • Knowledge of root cause analysis and problem-solving methods such as 8D, Pareto analysis, fishbone diagrams, and the 5 Whys.
  • Familiarity with assembly methods including screen printing, solder reflow, die bonding, and functional testing.
  • Ability to learn new assembly and metrology processes through training from the US-based engineering organization.
  • Willingness to train and review manufacturing processes across all factory shifts.
  • Proficiency in Microsoft Office and data analysis software such as JMP or Minitab.
  • Strong verbal and written communication skills.
  • Fluency in English and Thai.
  • Authorization for business travel to the US.

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