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Phononic Inc
Phononic Inc
51 – 200 Darbinieki
KonsultācijasLoģistikaRažošana
Phononic Inc develops solid-state thermoelectric cooling technology for data centers, AI infrastructure, networking optics, GPUs and high-bandwidth memory, alongside commercial cooling applications. Its compact, refrigerant-free devices and system kits combine thermoelectric hardware with software-defined Thermal Fabric controls, adapting cooling to workload changes. The company’s products and reference designs target lower energy use and reduced hardware throttling across enterprise and industrial deployments.
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Vakances uzņēmumā

Senior Manufacturing Engineer, On-Site in Thailand

Serve as Phononic’s technical lead at a contract manufacturing facility in Thailand. Improve assembly processes, equipment throughput, yield, quality, and production efficiency.

THTaizemeKlātienēPilna slodzeVidējais līmenisVecākais speciālistsNepieciešamā Valoda: angļuNepieciešamā Valoda: tajuInženieris
Asamblers

Apraksts

  • Share Phononic headquarters’ manufacturing procedures and best practices.
  • Train contract manufacturing operators, technicians, engineers, and planners in Phononic processes.
  • Develop, improve, and implement FMEAs, OCAPs, and work instructions with engineering, production, and quality teams in North Carolina.
  • Monitor in-line process yields and carry out escalation plans as needed.
  • Report failure modes to the global operations team and work with them on root cause analysis.
  • Verify new product setups and provide qualification support with the Contract Manufacturing NPI engineering team.
  • Configure manufacturing equipment to meet factory planning goals.
  • Serve as the on-site expert on Phononic assembly processes and equipment, improving throughput and yield.
  • Join daily manufacturing reviews with the US team.
  • Work with the on-site automation engineer to introduce next-generation manufacturing technologies on Phononic equipment.
  • Lead projects to reduce costs and improve process efficiency.

Prasības

  • Bachelor’s degree in engineering, science, or a related field, or equivalent.
  • At least 5 years of engineering experience in high-precision electronic device or semiconductor manufacturing.
  • Knowledge of root cause analysis and problem-solving methods such as 8D, Pareto analysis, fishbone diagrams, and the 5 Whys.
  • Familiarity with assembly methods including screen printing, solder reflow, die bonding, and functional testing.
  • Ability to learn new assembly and metrology processes through training from the US-based engineering organization.
  • Willingness to train and review manufacturing processes across all factory shifts.
  • Proficiency in Microsoft Office and data analysis software such as JMP or Minitab.
  • Strong verbal and written communication skills.
  • Fluency in English and Thai.
  • Authorization for business travel to the US.

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