Teradyne
Teradyne
5001 – 10 000 Darbinieki
AparatūraB2BRažošana
Teradyne izstrādā automatizētas testēšanas un ražošanas sistēmas elektronikas, pusvadītāju un rūpniecības nozarēm. Tās produktu portfelī ietilpst pusvadītāju un elektronikas testēšana, rūpnīcu automatizācija, sadarbības roboti un mobilie roboti, ko piedāvā tādi uzņēmumi kā LitePoint, Universal Robots un MiR. Uzņēmuma tehnoloģijas palīdz ražotājiem palielināt caurlaidspēju, nodrošināt nemainīgu kvalitāti un uzlabot ražošanas efektivitāti dažādos rūpnieciskos lietojumos.

Field Application Engineer, Semiconductor ATE

Develop semiconductor ATE test solutions and customer tools for Teradyne. Support production releases, product demonstrations, troubleshooting, and customer design-ins.

Apraksts

  • Develop test solutions and programs, and provide production support for customer products and IP.
  • Analyze test correlation data and support production releases.
  • Support sales presentations and demonstrate products to customers.
  • Consult on software and hardware development.
  • Create tools for customer test program development and data analysis.
  • Apply technical expertise to deliver value to customers.
  • Train customers and provide test solutions, program releases, and troubleshooting on-site, remotely, or during overseas travel.
  • Respond to customer questions about system software and applications.
  • Develop application solutions around customer requirements to improve product performance and enable design-ins.

Prasības

  • Hold a master’s degree in Electro-Optical Engineering, Photonics and Optoelectronics, Electrical Engineering, Microelectronics, Computer Science, automation, or an equivalent field.
  • Have at least five years of semiconductor ATE experience.
  • Know and have experience with Teradyne ATE platforms such as UltraFLEX+, UltraFLEX, Flex, J750, Magnum, or Eagle, or other semiconductor ATE platforms.
  • Be proficient in VBA, VB, C, C++, C#, or Python, with experience developing application tools.
  • Have strong troubleshooting skills.
  • Communicate effectively in written and spoken English.
  • Understanding of silicon photonics, co-packaged optics (CPO), and PIC measurement or testing is preferred.

Priekšrocības

  • Medical claims coverage.
  • Group insurance.
  • Retirement plans.
  • Paid vacation and holidays.
  • Tuition assistance programs.
  • Health and well-being programs.

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